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Thermal Engineer

Huawei Ukraine LLC / Хуавей Україна, ТОВ
3 года назад
29 сентября 2020
Киевул. 10/14, Radischeva str., BC "IRVA"

About Huawei Technologies 

Huawei is a global leader of ICT solutions. Continuously innovating based on customer needs, we are committed to enhancing customer experiences and creating maximum value for telecom carriers, enterprises, and consumers. Our telecom network equipment, IT products and solutions, and smart devices are used in 170 countries and regions. Huawei is ranked 49th on the Global Fortune 500 in 2020.

 

Huawei Kyiv Research Center is Ukraine subsidiary of Huawei Technologies Co. Ltd. The R&D Center focuses on the  research and development of advanced thermal technology for the next generation of ICT products.

For more information visit http://www.huawei.com

 

Job Details

Position: Thermal Engineer

Location: Kyiv Research Center, Kyiv

 

Responsibilities

  1. Thermal analysis of various telecom equipment including requirement specification analysis.
  2. Perform cutting-edge research for microelectronics thermal management and thermal-mechanical design, including liquid cooling and embedded thermal dissipation etc.
  3. Develop conceptual designs and conduct feasibility studies.
  4. Handle cooperation projects with universities, academy of science institutes and industry companies.
  5. Expertise of conceptual design of equipment and comparison of various thermal solutions in both the cost and the functionality perspective

 

 

Qualifications Required

  1. PhD in thermal physics, heat engineering, materials science, mechanics, physics and related specialties.
  2. Excellent knowledge of heat/mass transfer, fluid dynamics, CFD, mechanics with a focus on electronics cooling application, technology of advanced materials.
  3. Hands-on experience (scientific experience) electronics industry, including thermal and thermal-mechanical management at component, board and system level, advanced materials.
  4. Experience in system thermal architecture design for electronic products would be an advantage.
  5. Proficiency in FEA analysis tools (ANSYS Fluent, ANSYS Thermal Mechanical, ANSYS Mechanical, FloTHERM, Icepak) and ability to perform complex thermal analysis to guide design.
  6. Team player with excellent interpersonal and communication skills.
  7. Strong feeling and interest for development and to share experiences with others in the team and have a proven capability to pursue creative solutions.
  8. Language skills: upper intermediate spoken and written English.
  9. Prior experience from international and multicultural work is preferred.
  10. Please send your English CV

 

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